Aug 17, 2024
Violumas M3X3L9 Module Recognized in 2024 IES Progress Report
Violumas is excited to announce the recognition of the M3X3L9 Module in the latest IES Progress Report, which is published yearly and highlights unique and significant advancements in the art and science of lighting. The Progress Report was presented at the IES Annual Conference on August 17, 2024 and featured a select number of the most innovative lighting products of the year.

The M3X3L9 Module is comprised of the VC3X3 UV LED COB and a fan-cooled heatsink for a powerful, cohesive product ready for plug-and-play application. It features a first-of-its-kind, high-density UVB/UVC LED array packed under a single 90° fused silica lens with up to 900mW of optical output.
By utilizing the Violumas-patented thermal technologies in the LED chip and MCPCB, the VC3X3 COB Series boasts the lowest thermal resistance on the market (0.1°C/W) and is able to be cooled with a compact fan-cooled heatsink, which maintains a junction temperature of 66°C for reduced thermal decay and long lifetimes.

The M3X3L9 Module will be featured in the LD+A Magazine’s November 2024 issue and local IES section meetings throughout the year.
Violumas is dedicated to providing the most innovative, high performance UV LED solutions to the market. Contact us today to learn more about the M3X3L9 Module and additional offerings for UVA, UVB, and UVC applications.