PCB MFG and SMT Assembly
PCB Manufacturing
We offer PCB design and manufacturing services in various materials, such as FR-4, metal substrates, etc., to ensure the performance and quality of the circuit board according to the customer's requirements.
SMT Assembly
We provide comprehensive SMT assembly services, including component procurement, SMD component placement, soldering, and other processes, to achieve efficient and precise circuit board assembly.
Violumas PCB Introduce
Super Pillar MCPCB
Super Pillar MCPCB provides a direct heat-conducting path for high-power LEDs by removing the dielectric layer (PrePreg, PP) in the aluminum substrate. The benefits of this are improved optical efficiency and reduced decay due to heat, resulting in increased LED light output and lifetimen.
MCPCB（Metal Core Printed Circuit Board）
MCPCB (Metal Core Printed Circuit Board) is a specialized type of PCB that uses a highly thermally conductive metal material, typically copper or aluminum, as its base.
Compared to traditional FR-4 PCB substrates, MCPCB substrates have higher thermal conductivity, allowing them to better dissipate heat generated by components like LEDs, achieving excellent heat dissipation performance.
The manufacturing process of MCPCBs is similar to that of traditional PCBs, with key differences in substrate material selection and processing methods.
MCPCB substrates are usually made from copper foil or aluminum plates, which are processed into the desired shape and thickness. A dielectric layer is then laminated onto the surface, followed by standard PCB manufacturing processes （including chemical etching, solder mask printing, and metal deposition） to produce the required circuit board.
Comparison of LED Package Materials
LED packaging uses three main types of PCBs: FR4, MCPCB, and Super Pillar MCPCB
The schematic diagrams of the PCB structures are shown below：
As shown in the diagram, heat generated by the LED chip needs to be conducted to the heatsink
FR4
In FR4 packaging, heat dissipation relies on FR4. FR4 has a thermal conductivity (K) of typically only 0.3-0.4 W/(m·K), resulting in high thermal resistance, leading to elevated LED chip temperatures, causing poor LED lifespan or even failure.
MCPCB
MCPCB significantly improves LED heat dissipation compared to FR4.
However, heat conduction still needs to pass through the insulating PP layer. PP typically has a thermal conductivity (K) of about 2-5 W/(m·K), much lower than aluminum alloy at 200 W/(m·K) and copper alloy at 380 W/(m·K). Although the PP layer can be thinned to 0.1mm, it still generates some thermal resistance.
Super Pillar MCPCB
Super Pillar MCPCB adopts copper pillar technology, eliminating the PP layer in the LED chip heat conduction path, directly transferring heat to the highly thermally conductive copper substrate, making it the current lowest thermal resistance LED packaging method.