3-PAD Flip Chip Technology
COB Technology Upgrade
2-PAD Flip Chip COB
• Lower Thermal Resistance (1°C/W)
• Without Die Substrate & Die Attach
• PCB (Dielectric)
3-PAD Flip Chip COB
• Lowest Thermal Resistance (<0.1°C/W)
• Copper Thermal Path
• Without PCB (Dielectric)
Leveraging years of experience in UVC LED packaging, Violumas provides bonding and packaging services for UV LED flip chips.
The UV output of bare chips can be maximized with proper packaging and optical solutions.
With in-house MCPCB/PCB production and our expertise in bonding technologies, we have prototyping and mass production capabilities in bare die/optics bonding. Violumas has full capability for reliability and endurance testing within our facility.
The Violumas engineering team has been researching and developing high performance components, recipes, and procedures for the most powerful and reliable UVC LED packages on the market. We develop and produce our own adhesives, resins, substrates, and structures, and employ high quality optics to produce products with the best combination of affordability, reliability, and power.
Our 3-PAD chips achieve industry-leading lifetimes and can be driven at extremely high currents due to minimized junction temperatures and effective thermal dissipation.
Customer Applications/Fields 【UV curing mainly uses UV light with wavelengths between 365-400nm】
-Advertising materials, large format printing
1.Understand customer requirements for curing light initiators, surface curing characteristics, and requirements.
2.Develop corresponding optimal effect light source modules for customer requirements and material properties.
3.UV LED light sources can be turned on and off instantly, without the need for preheating or cooling time. In the current environment of high electricity costs, traditional mercury lamps not only consume energy but also have issues such as low lifespan due to operation/material issues that need to be considered.
4.Can enhance curing light intensity in specific areas or cause line light source effects.
5.Complies with environmental regulations and allows customers to rest assured with environmentally friendly/economical concepts (5 times longer average lifespan, longer time between lamp replacements, etc.).
6.The work environment is hygienic and environmentally friendly. In addition to the factor of no mercury, there is no need to install deodorization or exhaust devices as there is no ozone generated after UV mercury lamp irradiation.
Production capacity / Photoelectric detection
Offering optoelectronic testing and analysis.
● Third-party certified UV spectrometer equipment
● UV integration sphere with high reflectance PTFE coating
● Large 1.5m integration sphere
● Equipment for various types of product performance analysis
LED Die Bonder
-1.jpeg)
Reflow Oven
Vacuum Oven
-1.jpeg)
-1.jpeg)
Integrating Sphere
Semi-Automatic Dispenser
-1.jpeg)