3-PAD Flip Chip Technology
Innovative LED Technology Realizing High Power Power LED Applications
COB Technology Upgrade
2-PAD Flip Chip COB
• Lower Thermal Resistance (1°C/W)
• Without Die Substrate & Die Attach
• PCB (Dielectric)
3-PAD Flip Chip COB
• Lowest Thermal Resistance (<0.1°C/W)
• Copper Thermal Path
• Without PCB (Dielectric)
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Leveraging years of experience in UVC LED packaging, Violumas provides bonding and packaging services for UV LED flip chips.
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The UV output of bare chips can be maximized with proper packaging and optical solutions.
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With in-house MCPCB/PCB production and our expertise in bonding technologies, we have prototyping and mass production capabilities in bare die/optics bonding.
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Violumas has full capability for reliability and endurance testing within our facility.
The Violumas engineering team has been researching and developing high performance components, recipes, and procedures for the most powerful and reliable UVC LED packages on the market. We develop and produce our own adhesives, resins, substrates, and structures, and employ high quality optics to produce products with the best combination of affordability, reliability, and power.
Our 3-PAD chips achieve industry-leading lifetimes and can be driven at extremely high currents due to minimized junction temperatures and effective thermal dissipation.
Production capacity / Photoelectric detection
Offering optoelectronic testing and analysis.
● Third-party certified UV spectrometer equipment
● UV integration sphere with high reflectance PTFE coating
● Large 1.5m integration sphere
● Equipment for various types of product performance analysis
LED Die Bonder
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Reflow Oven
Vacuum Oven
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Integrating Sphere
Semi-Automatic Dispenser
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